Laser Sonic Copper Wire Wedge Bonder
An innovative technology that heats the bond, making it easier to wedge bond copper wire.
Fully automatic wedge bonder equipped with a heating function. It supplies laser energy to the tool tip via a beam trap. By using a laser-heated bond tool for ultrasonic wire bonding, it improves joint quality. Localized heating occurs simultaneously with cooling, preventing oxidation of the surrounding area. Heating allows bonding with lower load and lower power, enabling wedge bonding of copper wire to chips with thinner pad thickness. Improved bond quality can also enhance yield.
- Company：Hesse Mechatronics Japan Co.,Ltd.
- Price：Other
