Copper wire wedge bonder - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Copper wire wedge bonder Product List

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Laser Sonic Copper Wire Wedge Bonder

An innovative technology that heats the bond, making it easier to wedge bond copper wire.

Fully automatic wedge bonder equipped with a heating function. It supplies laser energy to the tool tip via a beam trap. By using a laser-heated bond tool for ultrasonic wire bonding, it improves joint quality. Localized heating occurs simultaneously with cooling, preventing oxidation of the surrounding area. Heating allows bonding with lower load and lower power, enabling wedge bonding of copper wire to chips with thinner pad thickness. Improved bond quality can also enhance yield.

Company：Hesse Mechatronics Japan Co.,Ltd.
Price：Other

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Copper wire wedge bonder

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Laser Sonic Copper Wire Wedge Bonder for Semiconductor Manufacturing

Easily connect copper wire chips with innovative laser heating.

In chip connections for semiconductor manufacturing, the trend towards miniaturization and higher density has led to a demand for bonding to chips with thinner pad thicknesses. Particularly when using copper wire, traditional bonding methods require high loads and power, which pose risks of damage to the chip and reduced yield. Our laser sonic copper wire wedge bonder is equipped with a heating function that supplies laser energy to the tip of the bond tool, making it easier to achieve wedge bonding with copper wire. The laser heating improves bondability, enabling bonding at lower loads and power, which contributes to the application on chips with thin pad thicknesses and enhances bond quality, thereby improving yield. 【Application Scenarios】 - Copper wire bonding to chips with thin pad thicknesses - Semiconductor devices requiring high-density packaging - Manufacturing lines aiming to improve yield 【Benefits of Implementation】 - Reduced damage to chips through bonding at low loads and power - Improved bond quality due to enhanced bondability - Increased yield

Company：Hesse Mechatronics Japan Co.,Ltd.
Price：Other

Bonding Equipment
Copper wire wedge bonder

View product details

Added to bookmarks

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Bookmark has been removed

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Laser Sonic Copper Wire Wedge Bonder for Automotive Parts

Easier wedge bonding of copper wire using heating technology.

In the automotive parts industry, reliable connections such as sensor wiring are required. In particular, the bonding of copper wire to chips with thin pad thickness requires high technology and precise control. Improper bonding can lead to decreased product performance and failures. Our Laser Sonic copper wire wedge bonder addresses these challenges with innovative heating technology. 【Application Scenarios】 - Wedge bonding of copper wire in sensor wiring - Bonding to chips with thin pad thickness - Improving reliability of automotive parts 【Benefits of Implementation】 - Improved bondability - Achieving bonds with low load and low power - Improved yield due to enhanced bond quality